Isolationsschichten auf der Grundlage organisch modifizierter Keramiken und deren Applikation

Abstract

The need for efficiency of electronic products requires an increasing integration density in the field of the PCB-production. For this application materials with a high level of thermal, chemical, and electrical properties are required. A suitable polymer system has been developed which can be applied e.g. by an electrophoretic deposition or dip coating procedure on metallic materials (metal core base materials). This thermal and photocurable new inorganic-organic hybrid polymer (ORMOCER = ORganically MOdified CERamic) shows excellent electrical, thermal, and chemical properties compared to those required for FR-4 materials.