Synthesis of high performance Cu/polyimide adhesives based on inorganic-organic composite materials

Abstract

Sealing of Cu to polyimide in a hot melt process is difficult due to the very different surface properties of Cu and polyimide. Silicone-based systems are widely used due to their heat resistance, but their sealing strength is still rather low. A new hot melt system has been developed by using silane-based oligomers with polar groups (-OH and -NH2) to provide good adhesion and aromatic epoxy units to tailor the stress dissipation ability of the system during the peel test. The system is cured by heat, shows a peel strength of 10 N/cm and is stalbe up to 180 °C. The synthesis principles and the general properties of the system as well as the sealing performance are described.