Sol-gel synthesis of a diepoxy-crosslinked ormocer adhesive for Cu/polyimide sealing systems

Abstract

Sol-gel-derived ORMOCER adhesives starting from methyl-vinyl silanes, diphenyl silanes and tetraethoxy silanes with tailored strain dissipation properties have been synthesized and tailored as hot-melt sealing adhesives for Cu to polyimide. In order to establish an appropriate strain dissipation mechanism within the brittle ORMOCER systems used as starting materials, an organic polymer chain based crosslinking reaction, linking amino groupings bonded to silanes together with difunctional epoxides was investigated. For controlling the process, spectroscopic data were used and correlated to peel strength. The system shows a peel strength of 10 N/cm, good dielectric properties and a high heat stability.