Please use this identifier to cite or link to this item: doi:10.22028/D291-41653
Title: Overcoming thermal instability of polymeric Core-Shell-Particles: Advanced processing options for the preparation of Stimuli-Responsive structural color materials
Author(s): Siegwardt, Lukas
Gallei, Markus
Language: English
Title: Chemical Engineering Journal
Volume: 480 (2024)
Publisher/Platform: Elsevier
Year of Publication: 2023
Free key words: Photonic Crystals
Stimuli-Responsive Polymers
Polymer Processing
Emulsion Polymerization
3D Printing
Self-Assembly
DDC notations: 500 Science
Publikation type: Journal Article
Abstract: Core-shell particles (CSP) represent one of the most promising building blocks for the artificial production of stimuli-responsive materials with iridescent structural colors. Despite tremendous efforts in the past two decades, scalable processing options for CSP are overall rare and mostly limited to 2D structures in the form of films and foils. This work investigates why common large-scale polymer-processing techniques, such as injection molding or fused filament fabrication, are hardly applicable to state-of-the-art CSP: While rheological prerequisites are fulfilled, thermal stability is proven to be surprisingly poor. Temperature instability during processing is caused by a thermally induced cross-linking reaction of residual reactive moieties. This undesired cross-linking reaction can be efficiently suppressed via optimizations of the particle architecture, in terms of adjusting the core-to-shell ratio and number of grafting anchors. Thermal stability can be further increased upon incorporation of primary antioxidants. The theoretical framework and the feasibility of the developed solution strategies are verified by a variety of thermoanalytical methods, including differential scanning calorimetry, thermogravimetric analysis, as well as rheological and mechanical measurements. Finally, advanced CSP are developed and demonstrated to be conveniently processable at elevated temperatures of up to 250 ◦C. These next-generation CSP formulations are advantageous for established processing techniques and may further pave the way for the design of new largescale methods suitable for industrial use. Potential applications are smart sensors, advanced display technologies, or anti-counterfeiting materials.
DOI of the first publication: 10.1016/j.cej.2023.148168
URL of the first publication: https://doi.org/10.1016/j.cej.2023.148168
Link to this record: urn:nbn:de:bsz:291--ds-416534
hdl:20.500.11880/37297
http://dx.doi.org/10.22028/D291-41653
ISSN: 1385-8947
Date of registration: 21-Feb-2024
Description of the related object: Supplementary data
Related object: https://ars.els-cdn.com/content/image/1-s2.0-S1385894723069000-mmc1.docx
Faculty: NT - Naturwissenschaftlich- Technische Fakultät
Department: NT - Chemie
Professorship: NT - Prof. Dr. Markus Gallei
Collections:SciDok - Der Wissenschaftsserver der Universität des Saarlandes

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